Rigid-Flex PCB Technology

Rigid-Flex PCB Technology

We produce multilayered flex and rigid printed circuit boards which are interconnecting layers which help our electronics engineers / design engineers to have the flexibility to use them as per their custom application / product design requirements which will also reduce cost.

Rigid-flex PCB’s is not just ordinary flexible printed circuit board. It’s composition substrate lamination into single board that creates many opportunities and can also allow circuit board / electronic device manufacturing designers to find substitute of multiple printed circuit board interconnection with connectors, wires and ribbon cable to create a single printed circuit board with a view to improve overall performance, reliability and scalability in the process.

MNT Electronics brings tomorrow’s innovations today. Our consistent focus on innovation and developing new technologies is nurtured through continuous learning, excellence, distinction, investment and strong customer and supplier relationships. At MNT Electronics, we believe we possess what it takes to make us the ideal partner to provide electronics manufacturing, engineering and design services for your emerging technologies in mechatronics, green energy, and nanotechnology.

Printed Circuit Board Solution:

  • Multi-Layer Rigid & Flex Circuits
  • Rigid Flex Printed Circuit Boards
  • High Frequency Circuit Boards
  • Hi-Tech Multilayer Circuit Boards
  • Prototype Printed Circuit Boards
  • High Density Rigid & Flex Circuits
  • Complex Multilayer Circuit Boards
  • Rigid-Flex PCB Production / Prototype

Benefits of Rigid Flex PCBs

  • Space requirements can be minimized by applying 3D (Rigid / Flex)
  • By removing the need for connectors and cables between the individual rigid parts the board size and overall system weight can be reduced.
  • By maximizing space, there is often a lower count in parts.
  • Less solder joints assure higher connection reliability.
  • Handling during assembly is easier in comparison with flexible boards.
  • Simplified PCB assembly processes.
  • Integrated ZIF contacts provide simple modular interfaces to the system environment.
  • Test conditions are simplified. A complete test prior to installation becomes possible.
  • Logistical and assembly costs are significantly reduced with flex-rigid boards.
  • It is possible to increase the complexity of mechanical designs, which also improves the degree of freedom for optimized housing solutions.

Capabilities and Design Rules: Flex & Rigid Flex

Description Preferred Standard
Number of Layers 1 to 12 12 to 24
Thickness Tolerance +/- 10% +/- 8%
Trace Width (mils) – 0.5 oz Copper 5 and above 3 to 4
Trace Width (mils) – 1.0 oz Copper 8 and above 5 to 7
Smallest Hole Size -Mech. Drilled 10 mils 8 mils
Smallest Hole Size -Laser Drilled 4 mils 2 mils
Aspect Ratio – PTH 6:1 or Less Up to 10:1
Aspect Ratio – Blind Microvia 0.5:1 0.75:1
SMT Pitch (mils) Over 14 6 to 14
Impedance Control Tolerance +/- 15% +/- 10 %
Min. Pad Size – Int. (mils) FHS + 22 FHS + 18
Min. Anti Pad Size (mils) FHS + 32 FHS + 26
Min. Pad Size – Button Plate (mils) FHS + 25 FHS + 20
Min. Pad Size – Pattern Plate (mils) FHS + 22 FHS + 18
Min. Soldermask Clearance 8 mils 6 mils
Min. Soldermask Webbing 8 mils 6 mils
Min. Coverfilm Webbing 14 mils 10 mils
Covercoat Type Coverfilm Flex LPI
Allowable Squeeze out per Side 5 mils/mil 3 mils/mil
Trace Geometry Curved 45 degrees
“I-Beam” Traces None Minimal
Grain Direction Specified Longitudinal
Ground Plane Cross-hatched Perforation
Strain Relief Yes Yes
Inside Corner Wide Radius Radius
Construction Material Balanced Mixed
Bend Radius Over 18x 10x to 18x